　　R & D

We can tailor our services to your needs. Please feel free to contact us.

Product Design
	Software Development:	MPU programming (Assembler, C++)
	PCB:	Circuit design　→　Layout　→　PP, M/P
	Construction:	Case design　→　Mold design　→　PP, M/P

Semiconductor Packaging
	We can suggest custom packages with high novelty; a variety of mountings.
	POP (Package on Package)
	COF (Chip on Film) --- Reel & Sheet type
	TCP (Tape Carrier PKG)
	TBGA (Tape Ball Grid Alley)
	MEMS Package
	HM (Half-Milli) CSP